Heat Sink Clamp

Clip these heat sinks onto circuit boards semiconductors and other heat sensitive electrical components.

Heat sink clamp.

Step 8 power console on. I started using heat sink clips for semiconductor soldering in the 70s and was even lucky to have kept them when their widespread use as roach clips got many sellers to stop offering them but these are longer better designed offer right angle finger push points at the spring end and multiple clamp points at the jaw. Make offer nintendo switch oem heatsink hac 001 ps3 heat sink cech p01. They protect equipment from damage by dissipating excess heat.

Mouser part 567 693 50. Heat sink material. Heat sinks heat sink board mount to220 integrated clip black anodized solder to pcb attachment 50mm length 35 05mm. Heat sinks heat sink board mount to220 integrated clip black anodized solder to pcb attachment 50mm length 35 05mm height 22mm width enlarge mfr.

Add comment cancel. Nintendo switch oem heatsink hac 001 15 99 4 75 shipping. Make offer genuine oem microsoft xbox 360 s slim heatsink heat sink w clamp. Click here to see a demo.

Fin clamp element by fab tek logic llc 6781 marilyn drive maple grove mn 55369. Add a comment. Add a comment. After third washer has been installed and the screws have been tightened touch the power pad on the.

Genuine oem microsoft xbox 360 s slim heatsink heat sink w clamp. Find hose clamps with heat shrink hose clamp style and get free shipping on orders over 99 at summit racing. The fin clamp element is a heat sink and can be used for heat transfer for multiple applications you ll find many uses. In computers heat sinks are used to cool cpus gpus and some chipsets and ram modules.

If the ps4 still does not work after adding two washers you will then remove the heat sink clamp and add a third washer under each heat sink clamp screw. A heat sink also commonly spelled heatsink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium often air or a liquid coolant where it is dissipated away from the device thereby allowing regulation of the device s temperature.