Heat Sink Design

Analysis demonstrated that the design with heat pipes running above the components kept junction temperatures within 2 c of the original.

Heat sink design.

Based on this definition anything from a rectangular sheet of metal to a complex finned copper or aluminum extrusion can be used as a heat sink. Reference the blog post the importance of radiation in heat sink design for a detail review of the role radiation plays in heat sink performance. One of the most critical parameters of a heat sink is the material from which it is constructed. Some of the more common construction materials for heat sinks are aluminum and copper.

Heat transfer from the heat sink consists of radiation and convection from both the intra fin passages and the unshielded surfaces of two outer fins. The general theory behind a heat sink is to increase the surface area of the heat producing device enabling a more efficient transfer of heat into the ambient environment. In this article we ll walk you through the basics of heat sinks and heat sink design including the calculations involved in defining the proper heat sink for your application. Heat sinks are an important element in circuit design because they provide an efficient path for heat to be transferred into the ambient air and away from electronic devices eg.

Thermal conductivity of the material should be as high as possible. One with heat pipes that stopped at the edge of the components and the other with heat pipes that ran above the components. Heat sink characteristics a suitable heat sink can now be selected. The variables ε is the surface emissivity of the heat sink.

A heat sink transfers the thermal energy generated by an electronic assembly or component into a cooling medium. A heat sink also commonly spelled heatsink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium often air or a liquid coolant where it is dissipated away from the device thereby allowing regulation of the device s temperature. In this report both parts are considered separately. Bjts mosfets linear regulators etc.

Ats engineers used analytical modeling and cfd simulations to examine the thermal performance of two aluminum heat sink designs. The heat is transferred from a higher temperature region electronic component to a lower temperature region fluid medium by conduction. Heat sink design goals may vary but in this report optimization of the vertical heat sink is the main objective. Cad model of a heat sink.

As the amount of power dissipation in the device increases the size of the heat sink must increase to allow more surface area to be exposed to the ambient. Heat sink design key considerations in heat sink design. As with the natural convection heat sink calculations the radiation heat dissipation q r1 from the area a 1 is calculated using equation 9. In computers heat sinks are used to cool cpus gpus and some chipsets and ram modules.

First the heat sink material and size are considered.